澳门银河app下载_君正 Ingenic Semiconductor

澳门银河app下载

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          English

          智能物联

          智能视频

          智能穿戴

          CPU技术

          可穿戴平台

          物联网平台

        1. Halley2
        2. Halley
        3. 智能视频平台


          • 专业级成像ISP和H.264编码(960P)

          • 高性能处理器支持智能分析(>1G CPU,128Bits SIMD引擎)

          • 业内最低功耗(典型功耗390mW 含DDRII)


          芯片框图


          T10高清



            芯片规格

          CPU

          XBurst single core, up to 1GHz.
          MXU2.0 IVS Engine, innovative 128 bit SIMD extension instruction
          32KB L1 I-cache and 32KB L1 D-cache.
          128KB L2 unified cache. 
          Hardware floating point unit.

          Encoder engine

          H.264 baseline, main profile

          MJPEG/JPEG Baseline

          Encode Performance

          Max resolution 1280x960

          Up to H.264 960P@40fps encode

          H.264 multiple streams

          --720P@30fps+VGA@30fps+JPEG@15fps

          --960P@30fps+VGA@30fps+JPEG@15fps

          ABR/VBR/CBR/CQP

          8 ROIs

          5-layer OSD with hardware

          ISP

          AE, AWB, AF

          Lens shading correction

          Advanced spatial noise reduction

          Motion-adaptive temporal noise reduction (3D de-noise)

          Multi-exposure HDR image fusion (WDR)

          Space-variant HDR processing

          Host tuning tools

          Memory

          Embedded DDRII@400Mhz

          Maximum capacity of 512Mbit

          Computer Vision

          Motion Detection/Perimeter Protection

          Face Detection

          Human Detection

          People Counting

          License Plate Recognition

          CMOS Sensor

          Maximum 12 bit HSYNC/VSYNC (DVP)

          I2C sensor control, Flash and DC control

          Programmable sensor clock output

          Up to 100M pixels/s input

          Audio

          Embedded audio CODEC.

          AAC, G726, G711, PCM encoding

          Echo cancellation

          On-chip Peripherals

          POR, RTC, WDT

          2 channel ADC

          UART x 2, I2C x 2, SPI x 2, GPIO x 12

          SDIO x 2, support SDHC

          PWM x 4

          USB OTG

          RMII EMAC, support PHY clock output.

          Security

          AES/DES/3DES by Hardware

          Global unique Chip ID

          32Byte customer OTP

          Physical Feature

          Less than 400mW power consumption including DDRII

          TFBGA181 ROHS, ball pitch of 0.65mm,body size of 10mmx10mm

          OS

          Linux-3.10.




            资料下载


          File

          Description

          T10_PB.PDF

          T10 芯片简介


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